Interscale Mounting Bracket for 70 mm Flexible Heat Conductor (FHC), Intel CPU
Interscale Mounting Bracket for 70 mm Flexible Heat Conductor (FHC), Intel CPU
katalogové č: 24830-002
The mounting bracket enables a user to assemble an Intel or AMD processor.
Podrobnosti
Prostředky
Item(s) Delivered
CAD
Distributoři ve Vašem okolí
Vlastnosti
- Designed for ATX/ITX/Mini ITX & COM using Intel core-i processors and AMD processors with the following sockets: Intel: LGA775, LGA1150, LGA1155, LGA1156, LGA1366, LGA2011 ; AMD: AM2, AM2(+), AM3, AM3(+), FM1, FM2, FM2(+)
- Utilizes keep out zones to not interfere with other board components
- Designed to assemble the 70 mm Flexible Heat Conductor to thhe CPU
Specifikace
Vlastnosti produktu
Delivery of this product includes the following item(s):
| Item | Popis | Množství | |
|---|---|---|---|
| 1 | Mounting bracket with associated hardware | 1 |
GENEROVÁNÍ CAD
*Data subject to change without notice
Níže je seznam autorizovaných distributorů, kteří mají aktuálně tuto položku skladem:
| Distributor | Množství | Datum na skladě |
|---|
*The price shown is the per piece price and does not include VAT. Depending on local conditions, packaging and freight charges might not be included. Where these charges should be part of the total price, they are included in the quote. The price given is a non-binding recommended retail price (RRP), which is the nVent list price. The final sales prices of local distributors may vary. Quotations requested or generated on SCHROFF.nVent.com are only valid for commercial customers (B2B). The lead time displayed above is an estimate for this item to be dispatched from an nVent Schroff facility. Transit delivery times are not included in this estimate, as transit time may vary, depending on delivery address, parcel dimensions, and other factors. Cut-outs and modifications placed in non-recommended areas ("collision detected") for configured products may be subject to additional engineering and/or design costs, which may increase initially quoted prices.
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