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Liquid Cooling Flow Through Module

Next Level Cooling Solutions for Advanced MIL computing power

 

Although software is advancing rapidly, processors must remain the same size or shrink to meet SWaP requirements. As the upper threshold of board level heat and power dissipation continues to rise, it is exceeding the limits of air and conduction cooling, requiring more advanced solutions to keep boards from overheating. 

nVent SCHROFF has developed a Liquid Flow Through cooling solution in accordance with VITA Standard 48.4 which will allow customers to solve their thermal challenges with a customized flow through path that transfers heat away from processors. 

This provides superior heat dissipation compared to air or conduction cooling, with cooling capacity of approximately 300+ watts per 6U slot.

Advanced Cooling Options

Thermal Design Expertise

  • Over 20 years of expertise in liquid cooling
  • Offer simulation and testing of module
  • Can design and develop entire liquid flow through module
Mil Cabinet Certifications

Meets Rugged Standard

  • Meets REDI compliance
  • Meets VITA 48.4 for:
    ○ Standard leak proof interconnect for coolant 
    ○ Ruggedized Architecture 
    ○ 300W cooling capacity for 6U board/modules
  • Built in nVent ITAR registered facility
Custom Off the Shelf (COTS)

Customization

  • Can customize flow path, ambient temperature and board layout
  • Ability to maximize thermal performance and develop specifications for 3U boards
  • High degree of customization with low minimum quantities

Functional Overview

Technical Paper Download

How Liquid Flow Through Modules Work Reliably in Rugged Environments

FAQS

nVent SCHROFF 如何确保液体/冷却液不会直接接触电子设备?

nVent SCHROFF 采用 VITA 48.4 和 SOSA 技术标准设计出液体循环模块。该模块通过焊接方式固定于 MIL 标准镀层结构中,在液体与电子设备之间形成无泄漏屏障。速断装置通过我们的 311 系列助插器/助拔器牢固连接至任何 VITA 48.4 机箱,它在连接器上施加正压的同时,借助高夹持力 Card-Lok 将电路板锁定在机箱内,这样进一步增强了安全性。

nVent SCHROFF 是否可以定制 3U 和 6U 模块?

可以,我们的工程团队可使用内部热仿真技术来构建最理想的流道,以满足独特的印刷电路板设计需求。3U 模块的单插槽散热能力高达 150W,6U 模块的单插槽散热能力高达 300W。

nVent SCHROFF 是否可以提供所需的电路板固定器和助插器/助拔器?

可以,除了提供定制流道模块外,nVent SCHROFF 还可以推荐符合要求的 Card-Lok 和助插器/助拔器。大多数情况下,建议使用高夹持力 (HC) 系列 Card-Lok 和 HF311 系列助插器/助拔器。

液体如何进入循环模块?

液体冷却液通过符合 VITA 48.4 标准的机箱内的防漏速断装置供应至 PCB 模块。冷却液从外部源头供应至机箱。

如何联系订购液体循环模块?

客户可填写下面的“联系我们”表格,与 nVent SCHROFF 取得联系。

Contact Us

To learn more about our Liquid Flow Through Cooling Module. Our specialists are here to help you find the perfect fit.

Liquid Cooling Module