Interscale Flexible Heat Conductor (FHC), 70 mm
详情
资源
功能
- Designed for ATX/ITX/Mini ITX & COM using Intel core-iprocessors and AMD processors with the following sockets: Intel: LGA775, LGA1150, LGA1155, LGA1156, LGA1366,LGA2011 ; AMD: AM2, AM2(+), AM3, AM3(+), FM1, FM2, FM2(+)
- Compatible with Interscale C enclosures
- Provides industry leading conduction cooling performance, 70% improvement over current conduction cooling methods
- Conductor block expands/contracts vertically to compensate fortolerance stack up and optimizes surface contact and pressurealong the thermal path; eliminates the need for a thermal gappad
- Secured to PCB with mounting brackets, sold separately
技术参数
- 警告
- 应仅根据 nVent 的产品说明书与培训材料安装并使用 nVent 的产品。可访问 www.nvent.com 获取说明书，或者向您的 nVent 客服代表索取。错误安装、使用不当、滥用或未能完全遵守 nVent 的说明与警告，可能会造成产品故障、财产损失、严重的人身伤害及死亡和/或使得保修服务无效。