Next Level Cooling Solutions for Advanced MIL computing power
Although software is advancing rapidly, processors must remain the same size or shrink to meet SWaP requirements. As the upper threshold of board level heat and power dissipation continues to rise, it is exceeding the limits of air and conduction cooling, requiring more advanced solutions to keep boards from overheating.
nVent SCHROFF has developed a Liquid Flow Through cooling solution in accordance with VITA Standard 48.4 which will allow customers to solve their thermal challenges with a customized flow through path that transfers heat away from processors.
This provides superior heat dissipation compared to air or conduction cooling, with cooling capacity of approximately 300+ watts per 6U slot.
Thermal Design Expertise
- Over 20 years of expertise in liquid cooling
- Offer simulation and testing of module
- Can design and develop entire liquid flow through module
Meets Rugged Standard
- Meets REDI compliance
- Meets VITA 48.4 for:
○ Standard leak proof interconnect for coolant
○ Ruggedized Architecture
○ 300W cooling capacity for 6U board/modules - Built in nVent ITAR registered facility
Customization
- Can customize flow path, ambient temperature and board layout
- Ability to maximize thermal performance and develop specifications for 3U boards
- High degree of customization with low minimum quantities
Functional Overview
Technical Paper Download
FAQS
- How does nVent SCHROFF ensure liquid/coolant does not come into direct contact with electronics?
nVent SCHROFF designed the Liquid Flow Through Module using VITA 48.4 and SOSA technical standards. The module is welded into MIL standard plating, creating a no leak barrier between the liquid and electronics. Quick disconnects securely connect to any VITA 48.4 chassis with our 311 Series inserters/extractors, providing positive pressure on the connectors, with further security coming from high clamp force Card-Loks to lock the board within the chassis.
- Can nVent SCHROFF design custom 3U and 6U modules?
Yes, our engineering team can create the most optimal flow path using in-house thermal simulations to meet that unique printed circuit board design. The 3U module can cool up to 150W per slot and 6U module can cool up to 300W per slot.
- Can nVent SCHROFF provide the required board retainers and inserters/extractors?
Yes, in addition to providing a custom flow path module, nVent SCHROFF can recommend the right Card-Lok and Inserter/Extractor to meet the requirements. In most cases, a high clamp force (HC) series Card-Lok and a HF311 Series inserter/extractor will be recommended.
- How does liquid get into the Liquid Flow Through Module?
Liquid coolant is supplied to the PCB modules via leak-proof quick disconnects located inside the VITA 48.4 compliant chassis. Coolant is supplied to the chassis from the external coolant source.
- How can a customer get in contact/order a Liquid-Flow through module?
Customers can get in contact with nVent SCHROFF by filling out the Contact Us form below.
Contact Us
To learn more about our Liquid Flow Through Cooling Module. Our specialists are here to help you find the perfect fit.
