nVent launches Liquid Flow Through Module
nVent Electric plc (NYSE: NVent) (“nVent”), a global leader in electrical connection and protection solutions, today announced the release of the nVent SCHROFF Liquid Flow Through Module. This liquid cooling technology is used in rugged environments to dissipate heat from individual printed circuit boards (PCB), allowing for more reliable cooling at higher processing power than traditional conduction cooling can provide.
The solution, part of the nVent SCHROFF product line, applies the VITA Standard 48.4 liquid cooling standard to create a safe and reliable form of embedded cooling utilizing liquid. Each Liquid Flow Through Module is designed with a customized flow path that specifically targets processors to carry warm air away from the PCB, back to the chassis, where the liquid will be cooled.
With more than 20 years of expertise in liquid cooling, the nVent engineering team can customize each board layout to the customer's unique PCB design, utilizing simulations to develop optimal cooling configuration. The rugged nVent SCHROFF portfolio includes corresponding board retainers and extractor components that meet liquid cooling standards for military electronics open systems platforms.
Designed and manufactured in an AS9100-certified factory in San Diego, California, the Liquid Flow Through Module meets VITA (48.4) and SOSA standards, along with being DFARS, JOSCAR, and ITAR compliant. Applying VITA 48.4 allows the modules to meet advanced requirements for shock and vibration resistance.
To learn more about how nVent liquid cooling engineering experts can design an effective liquid cooling module, please visit the Liquid Flow Through Module page.