Next Generation 
Liquid Cooling 
and Power Portfolios

Introducing next generation liquid cooling and high density power standard portfolios to support AI and HPC workloads now and into the future. 

Both portfolios will be managed by a single, intelligent common control platform. Watch this page for updates as these exciting new products are available in the first half of 2026.

nVent Row Based CDU CX121​

Future-Proof Performance and Flexible Design: ​The nVent CX121 CDU is an intelligent, future-proof liquid cooling foundation that enables peak performance for all high-density chips with best-in-class flowrates and scalable reliability. ​

Modularity enables configurability to match application needs and nVent services ensure deployment is seamless and on-time while preventative maintenance protects your investment.​

nVent OCP Project Deschutes Row Based CDU​

Trusted Provider and Technical Assurance: As a participant in Google’s Project Deschutes 5.0, nVent is recognized as a reliable provider in next-gen infrastructure, offering cooling solutions that meet the highest standards for high-density, AI-ready compute for hyperscalers and colocation providers. 

This initiative underscores the necessity of liquid cooling for scaling AI infrastructure, enabling innovation in controls and efficiency while ensuring reliability and standardization for this specific design point.

nVent Technology Cooling System (TCS) Manifolds​​

Modular. Configured. Rapidly Deployed.​ nVent’s innovative Modular and Scalable Technology Cooling System (TCS) provides the rapidly deployable, highly flexible secondary fluid network that eliminates complexity and long lead times, ensuring uncompromised time to market delivery for your high-density AI and HPC compute environments.​

nVent Rack Based CDUs CZ61 (AC Power) and CZ62 (DC Power)​​

Kickstart AI deployments: Deploy NVIDIA GB200 and GB300 racks with an architected liquid cooling solution that delivers the precise flow and pressure for 5x performance over previous nVent rack CDU generations, optimizing your service economics with a scalable, "pay-as-you-grow" model. 

nVent also offers racks and rack manifolds as well as the wall of cool and RDHx for a full rack and roll solution.​

nVent OCP ORV3, NVIDIA MGX, and Server Racks and Rack Manifolds​

Rack and Roll Solutions
As a complete OCP solutions provider, nVent now offers three new rack architectures, including purpose-built platforms for NVIDIA MGX and OCP ORV3 liquid-cooling-centric deployments. These pre-validated IT server rack solutions provide the flexible foundation to rapidly deploy the highest-performance equipment, supporting NVIDIA's modular MGX and the OCP ORV3 standard for reduced time-to-market.​​​

By integrating nVent's complete set of associated components—including rack manifolds, Coolant Distribution Units (CDUs), Wall of Cool, and Rear door heat exchangers—into a standard platform, they deliver a powerful, rapidly deployable solution. This unified approach significantly increases reliability and cuts overall costs for modern AI factories and high-density computing.​​​​

Future Proof Performance:​ 

• Three phase for high-efficiency power delivery 

• High current and high density outlets to support AI-scale infrastructure

Easy Power Management:

• Data streaming enabling data to be pushed or pulled 

• Built-in event engine that enables conditional rules and automations for simple rack level management

Simplified setup and operations:​ 

• Enhanced user experience through integrated touchscreen for local PDU control and instant visibility into key data 

• Upgraded web GUI is modern, intuitive, and features configurable dashboards providing insights where you need them 

• Leverages new nVent control platform for reliable control across power and cooling infrastructure